M/L Up to 24 Layers
Though we still manufacture double sided board prototypes, our largest product range is in the multilayer arena.
Standard constructions are used on most multilayers, unless a design print has alternate instructions. In most cases, the standard build-up for internal layers which are ground or power planes will be built on 1oz copper, and signal layers are built on 1/2oz copper weight. 1/2oz copper foil is used on outer layers, unless the design demands otherwise.
Our order of precedence primarily relies on your board print and any stack-up information provided at the time of quote. If there are impedance requirements in the design, the order of precedence will revert to the impedance calculations, with your approval if required.
The following are our standard stack-ups:
- 4 Layers: 0.028” core (middle dielectric)
- 6 Layers: 0.014” core (dielectric)
- 8 Layers: 0.008” core (dielectric)
- 10 layers: 0.006” core (dielectric)
- 12 Layers: 0.005-0.004” core (dielectric)
- 14+ Layers: 0.003” core (dielectric)
| Rockymountain CIRCUITS COLORADO, Inc. | Rev 2/15/13 | |
| STANDARD PRODUCTION CAPABILITIES MATRIX | ||
| PCB FEATURE | STANDARD | ADVANCED |
| Standard Panel Size | 18″X24″ | (Contact Eng.) |
| Useable Area on Panel | 16.5″ X 22.5″ | (Contact Eng.) |
| Max. Board Thickness | 0.010″ | 0.003″ |
| Max. Board Thickness | 0.225″ | 0.228″ |
| Max Number of Layers | 16 | 26 |
| Minimum Circuit Width – (3/8 oz Cu) | 0.003″ | 0.0025″ |
| Minimum Circuit Width – ((1/2 oz Cu) | 0.004″ | 0.003″ |
| Minimum Circuit Width – (1 oz Cu) | 0.004″ | 0.0035″ |
| Minimum Circuit Width – (2 oz Cu) | 0.005″ | 0.0045″ |
| Minimum Circuit Width – (3 oz Cu) | 0.007″ | 0.006″ |
| Minimum Spacing Between Circuits – (3/8 oz Cu | 0.003″ | 0.0025″ |
| Minimum Spacing Between Circuits – (1/2 oz Cu) | 0.004″ | 0.003″ |
| Minimum Inner Layer Spacing Between Circuits – (1 oz Cu) | 0.004″ | 0.004″ |
| Minimum Inner Layer Spacing Between Circuits – (3 oz Cu) | 0.009″ | 0.009″ |
| Minimum Inner Layer Spacing Between Circuits – (2 oz Cu) | 0.006″ | 0.005″ |
| Minimum Inner Layer Spacing Between Circuits – (3 oz Cu) | 0.008″ | 0.007″ |
| Minimum Power/Ground Plane Separation – (3/8 oz Cu) | 0.004″ | 0.004″ |
| Minimum Power/Ground Plane Separation – (1/2 oz Cu) | 0.005″ | 0.004″ |
| Minimum Power/Ground Plane Separation – (1 oz Cu) | 0.006″ | 0.005″ |
| Minimum Power/Ground Plane Separation – (2 oz Cu) | 0.008″ | 0.007″ |
| Minimum Power/Ground Plane Separation – (3 oz Cu) | 0.012″ | 0.010″ |
| Minimum Pad Size Over Drill Size | 0.006″, 0.003″ per side | 0.005″, 0.0025″ per side |
| Minimum Core Dielectric Thickness | 0.003″ | 0.002″ |
| Smallest Drilled Via Hole | 0.0063″ | 0.0059″ |
| Preferred via hole tolerance | + 0.000″/ -0.0xx” | same |
| Maximum Hole-to-Board Thickness Aspect Ratio | 10 to 1 | 12 to 1 |
| Backdrilling | No | Yes |
| Minimum Plated Hole Tolerance | ± 0.003″ | ± 0.0025″ |
| Min. Solder Mask Clearance | 0.004″, 0.002″/side | 0.003″, 0.0015″/side |
| Min. Solder Mask Web Width – All colors | 0.004″ | 0.003″ |
| Min. Surface Mount BGA Pitch | 0.016″ | 0.012″ |
| Min. Cu Clearance From Edge | 0.005″ | 0.003″ |
| Cu Thickness Range | H oz to 3 oz | 3/8 oz to 4+ oz |
| Routing Dimension Tolerance | ± 0.005″ | ±0.003″ |
| Scoring Dimension Tolerance | ± 0.005″ | ±0.003″ |
| Scoring Web Thickness Tolerance (Thinnest material 0.018″) | ± 0.005″ | ±0.003″ |
| Controlled Impedance (Single-ended & Differential) | ± 10% | ± 5% |
| Blind / Buried Vias Capability | YES | YES |
| Controlled Depth and Selective Routing and Drilling | ± 0.008″ | ± 0.005″ |
| Countersink/Counterbore Capability All sizes | ±0.005″ | |
| Via Fill | YES | YES |
| Castellations and plated Slots | YES | YES |
| TMM Ceramic, Teflon, and Aluminum Substrates | YES | YES |
| Fusion Bonding of Teflon Substrates | YES | YES |
| Electrical Testing | 100% & Hi-Pot to 3000V | (Contact Eng.) |
We Promise to give you quality
