Default Manufacturing Specifications

Scope: When manufacturing specifications (i.e. prints) are not provided by the customer, Rockymountain Circuits
will quote use this specification.
Note: All PCBs will be built and inspected to the following IPC Standards: IPC-A-600 Class II Acceptability of Printed
Boards IPC-6012A Class II Qualification & Performance for Rigid Printed Boards

GENERAL: Order of precedence

Any notes on the Purchase Order
Customer provided drawing
Customer supplied specification
This specification

There shall be no functional deviation from customer data without customer approval.
All standard Printed Circuit Boards will be manufactured with UL approved materials and processes, with exceptions for experimental and/or exotic materials not covered under UL.
Each board will be marked with our logo, UL designator, and date code with the date code displayed in the following format: (WWYY). Location 1st choice: Top silkscreen, 2nd choice: Bottom Silkscreen, 1st choice with
no legend: Etch

Default stack up will be based on material availability and intended function, with a balanced foil construction. Default board thickness is 0.062” ±0.006”.

DEFAULT COPPER WEIGHTS: 1/2 oz Inner Layer Signals, 1 oz Inner Layer solid Planes, and 3/8 oz outer layer copper foil plated to 1 oz for a balanced foil construction. If spacing is less than .006 on Inner Layer Planes, or if mixed plane/signals, ½ oz copper will be used.

MANUFACTURING DEFAULTS:

Plating and Final Finish: If not specified, boards will be vertically Hot Air Levelled using Lead-Free solder and will be covered and solderable. Solder mask will be over bare copper.
Final Finish standard thickness: Immersion Gold: 2.5-3.5 micro inches • Nickel: 120-200 micro inches .Standard and Lead-Free Solder: 250+ micro inches
Screening and Soldermask: Soldermask will be Green Semi-Gloss Liquid Photo imageable mask over bare copper applied to both sides. Silkscreen will be white, permanent, non-conductive epoxy ink. Minimum line width for
silkscreen is .006”. Via plug/fill will be non-conductive epoxy via fill.

Physical Dimensional Tolerances: External Board: +/- .005” – Internal Features: +/- .003”

Required Spacing for Scoring (from conductor to board edge)